GigE Vision Camera

Based on the customer’s specifications, we designed a multi-board project of a GigE Vision Camera that includes a control board and an image sensor board.


  • Sony IMX264 CMOS Sensor
  • 0.5mm pitch BGA package Intel Cyclone V FPGA.
  • LPDDR2
  • PoE compatible Gigabit Ethernet
  • Data transfer between control board and sensor board through LVDS signals.

PCB Info:

Control Board

  • 38mm x 38mm size
  • HDI 2+8+2 layer stack-up
  • 293 components
  • 232 nets

Sensor Board

  • 25mm x 25mm size
  • HDI 2+2+2 layer stack-up
  • 103 components
  • 38 nets


The difficulty is caused by numerous factors. Both boards have a lot of components crammed into a small amount of space. Additionally, two boards are stacked upon one another, which limits the placement options. The complexity is increased by the fine-pitch BGA package, which is challenging to route out.


To address these challenges, we collaborated closely with the customer’s mechanical department to figure out the ideal placement choice. We also successfully solved the design’s routability by utilizing the via-in-pad, laser drilled via, and buried via technologies.