GigE Vision Camera

Based on the customer’s specifications, we designed a multi-board project of a GigE Vision Camera that includes a control board and an image sensor board.

Specification:

  • Sony IMX264 CMOS Sensor
  • 0.5mm pitch BGA package Intel Cyclone V FPGA.
  • LPDDR2
  • PoE compatible Gigabit Ethernet
  • Data transfer between control board and sensor board through LVDS signals.

PCB Info:

Control Board

  • 38mm x 38mm size
  • HDI 2+8+2 layer stack-up
  • 293 components
  • 232 nets

Sensor Board

  • 25mm x 25mm size
  • HDI 2+2+2 layer stack-up
  • 103 components
  • 38 nets

Challenge:

The difficulty is caused by numerous factors. Both boards have a lot of components crammed into a small amount of space. Additionally, two boards are stacked upon one another, which limits the placement options. The complexity is increased by the fine-pitch BGA package, which is challenging to route out.

Result:

To address these challenges, we collaborated closely with the customer’s mechanical department to figure out the ideal placement choice. We also successfully solved the design’s routability by utilizing the via-in-pad, laser drilled via, and buried via technologies.

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